IT융합산업팀

02-3460-7465

Nokia-Siemens Networks 社 구매희망 품목 리스트

기술 부문	관심 기술/품목	세부 사항
RF components	Circulators and Isolators	Three different technologies for circulators and isolators: - Classical drop in parts, SMD (surface mounted devices), Connectorized (integrated with connector) Single junction parts, double junction parts divided in hi-power parts (>5W) and low-power parts (<5W). Frequency range: 700MHz ~ 2700MHz (GSM: 800, 900, 1800, 1900 MHz / WCDMA: 2100 MHz) Microwave parts: over 10 GHz
Interconnections	PWB's	2~22 layers, HDI : 1+N+1, 2+N+2, Special Technology : POFV Surface : Immersion Silver, Immersion Tin, Immersion Gold, HASL, OSP, Hard Gold, Selective Gold/ENIG Track & Gap : 3/3mil,  Base Copper Thickness: ≥ 3 oz PCB Thickness: ≥ 3.2 mm  Material : High Tg ≥ 175 °C
	Connectors	2MM, FB, HM, ATCA, µTCA ; ATCA Zone1, Board to Board, Board to Wire, Cable Connectors, Card Edge Circular Connectors, DSub, Euroconn / DIN Connectors (DIN41612), Highspeed (ZD, XT, AirMax, Mulitbeam), MDR - Mini D Ribbon, Pin Headers Power Connectors, high power, high voltage, RJ45, SCSI, SFP, Sockets, & Holders, Terminal Blocks, IP67 Circular Connector
	Optics	Industrial Temp: -40/85 degC; Commercial: 0/70 degC; Extended: -10/80 degC Link Length – 300m, 2KM, 10KM, 40KM, 80KM, 120KM, 200KM  Form Factor – SFP and CFP, SFP+, T-XFP Data Rate: 10G, 40G and 100G, 10GBaseRoHS Compliance, Digital Diagnostic Monitoring (DDM) Function: SONET/SDH; GB Ethernet; OBSAI, Fiber Channel, STM1-STM16, xPON Optical Connection – SC / LC Receptacle         Wavelength – 850nm, 1310nm, 1550nm and bi-directional
	Cable Assemblies	Cable and Wire Harness Assemblies requirement : IPC/WHMA-A-620 General Specification for Electrical Characterization : CECC30800/30801 General Testing Method for cable assembly : IEC60068 General Environmental requirements : RoHS Compliance/Halogen Free

Passives (Capacitors) High Q capacitors, low ESR	MLCC	Voltage : 6.3V~2KV, Capacity : 0.3pf~100uf, Dielec : X7R/X5R/NP0, Case Size : 0402~1812, Tolerance: all
	Tantalum Capacitor	Voltage : 4V~50V, Capacity : 1uf~1mf, Case Size : A ~ E, Tolerance : all
	Aluminium Capacitor	high temperarure, re-flow capable
	Film Capacitor
Electro Mechanics	Switches technologies	Flex Push button, Toggle Switches, SMD DPI Switches
	LED technology	SMD Housing LEDs with lens
Inductive Components	Wirewound Chip Inductors	LAN transformers, T1/E1, Power Inductor, RF transformer and Balun. Customerized planar, capability for customized solutions
Discrete Components	Diodes	Power, Rectifier and small signal, 75 to 600V / 100mA to 8A / 4 to 50ns, in future SMx and SOD323 type packages Schottky, wide range from SOT23/100mA up to DDPAK/30A Zener, currently SOT23/BZX84/5% tolerance, in future SOD323/BZX384 TVS, SMx type packages/ 600-1500w/ms, wide range from 3.3V up to 150V
	Transistors	Small Signal, both NPN and PNP, 50-300MHz, 30-45V, mainly SOT23 Power, up to 300V RF MOSFET, mainly NPN / 20 to 400V, mainly 30-40V, round 5-10mOhm RDS In future ’Power’ pack type packages / 20-50A
기계 부문	관심 기술/품목	세부 사항
Die Casting Parts	-	High Pressure Al Die Castings from 0.02 Kg to 9 Kg made on HPDC machines from 350Tonnes to 2000Tonnes. -CNC Machining: Vertical Standard, Vertical with turntable, Horizontal CNC machines -Secondary Operations: De-burring, Straightening, Ultrasonic Washing -Supply Chain Management in house assembly line for bought out parts like pins, screws, thermal pads, etc. -Tooling shop floor management (either in-house or outsourced) -Surface Treatment (in special cases): Painting & Plating /Selective Plating includes but not limited to Nickel, Copper, Silver, etc.

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